BGA rework system

  • Top hot air heating, bottom infrared preheating & hot air heating. The optical prism 50*50mm ensures high precision alignment. Various types of titanium nozzles available, easy replacement. Powerful fan cools bottom heating area rapidly. Top hot air heating, bottom infrared preheating & hot air heating. The...

  • High automation, one-touch for rework, soldering, pick-up and placement of chip, easy operation. Large power brushless DC fan, closed loop sensor, microcomputer zero trigger control, large volume air with constant temperature. No need of external air source, flexible application. High automation, one-touch for rework, soldering, pick-up and placement of...

  • IR Part: Infrared temperature sensor detects surface temperature of BGA, close-loop control, even heat distribution. PL Part: Uses dichromatic vision alignment, make solder ball and pad coincide with each other, easy placement. RPC: View solder ball melting process from different sides, help capture reliable process curve. IR Part: Infrared temperature sensor detects surface temperature of BGA,...

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