Die Attach Adhesives        

tableau Underfill-001.jpeg

                                         underfill_transparent-crop-u26576.png           

The DA 90 series features solvent-free and fast curing thermosetting die attach adhesives. This series offers excellent adhesion to the substrate and bare die. These products can be used for small and large die attachments, and can be applied using dispense of print methods.
Advantages include high reliability and high temperature reflow performance.
This material is easily dispensed, minimizes induced stresses, provides outstanding reliability performance, and excellent mechanical resistance.
The DA 90 series can be customized in color, fillers, and particle sizes per the customer specifications and needs.

Our DA 150 series are solvent free and fast curing thermosetting electrically and thermally conductive, as well as electrically and thermally insulating, die attach adhesives.
DA 150 products have excellent adhesion to the substrate and bare die.
These products can be used for small and large die attachments, and can be applied using dispense or print methods. It has demonstrated high reliability and high temperature reflow performance.
The DA 150 series can be customized in color, fillers, and particle sizes per the customer specifications and needs.


              underfilltreedescriptions.jpg



If you have any questions or requests, please write to this email:

INFO@ATOO-ELECTRONICS.COM