Underfill Materials          

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Our SMT 158 capillary underfill series is a unique filled capillary underfill. It is a rapid curing and fast flowing liquid epoxy, which can be used as an underfill for : 
   - CSP
   - BGA
   - PoP
   - LGA
and flip chip applications. It is also suitable for bare chip protection in a variety of advanced, such as memory cards, chip carriers, hybrid circuits, and multi-chip modules.
This material is easily dispensed, minimizes induced stress, provides outstanding reliability performance, and excellent mechanical resistance. We offer a wide range of colors, filler concentrations,
and particle sizes to cater to our customer needs and requirements.


If you have any questions or requests, please write to this email: