Wafer Level Materials        

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Our ACP 120 series is an excellent option for customers looking for an antioxidation coating for solderable and metal surfaces such as zinc, nickel, steel, aluminum, and more. Features include excellent anti-oxidation performance and adhesion, excellent anti-corrosion and anti-rusting, high thermal resistance, room temperature drying, and easy rework when wet.

Some highlights are:
• Eliminates Gold Plating Process
• Low Cost Ownership
• Environmentally Friendly
• High Throughput
• Reworkable Process
• Large Process Window

ACP 120 can be customized to meet customer requirements.
Our WL 66 series are UV curable optical lid attachment adhesives designed for wafer level lens and optical lens attachment. They provide a bubble free optical coverage, high moisture resistance, and high temperature resistance.
The product also remains transparent and does not 'yellow'.


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If you have any questions or requests, please write to this e-mail:

INFO@ATOO-ELECTRONICS.COM