Come and visit us at the Electronics Forum from September 24 to 26, 2019 at Paris Expo Porte de Versailles on Booth B95!
Through our products, our competent team will advise you on:
- Optimization of your production times,
- The reduction of lost components,
- Qualification of consumables, processes and machines,
- Storage of cards and components,
- ESD equipment adapted,
- The supply of varnishes, resins and silver glue meeting REACH standards and without CMR.
As official distributor in France, we will highlight YINCAE and TOPLINE products on our booth.
If you do not know YINCAE, YINCAE Advanced Materials is a global leader in innovative technologies for high performance coatings, adhesives and electronic materials.
We will present you their following products: Board Level Assembly, Conformal Coating, Die Attach Adhesives, Thermal Interface Materials, Underfill Materials, Wafer Level Material.
We will also show you TOPLINE products. TOPLINE solutions allow you to qualify new consumables and the latest generation of components.
Their following products will be presented:
- Test components Daisy Chain, jumpers zero ohm,
- PID (Particle Impact Damper),
- CGA (Column Grid Array),
- SMT kits.
Our partner Retronix will also be present (booth B95) and we invite you to experience the Retronix experience through virtual reality glasses. You will be immersed in the heart of the process, the closest to your products to discover our services!
We are looking forward to your visit in hall 4 booth B95 at the Electronics Forum from 24 to 26 September 2019 at Paris Expo Porte de Versailles!