High temperature ESD crepe paper

High temperature ESD crepe paper for:

- masking of gold finger before wave soldering of PCBs.

- masking of PCBs before varnishing.

Leaves no residue.

Silicone-free adhesive allows optimal adhesion of the varnish.

Meets Nadcap : silicone free.

Surface resistance : 10^6-10^9 ohms.

Heat resistance : until 200°C.



Also available in dots and made to measure.

Polyamide film, built with crepe paper and acrylic.

No glue residue.

Resistant to chemicals.

For more detailed product information, please contact us directly.


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